D B C
FJ Composite S-DBC (Sputtering Diffusion Bonded Copper)
We developed insulated circuit board used in IGBT (Insulated Gate Bipolar Transister) , which is used as a high power frequency conversion device such as a hybrid car, a fuel cell car, an electric vehicle, a Shinkansen, CS-DBC). In recent years, when SiC replaced Si for semiconductor, SiN for insulating ceramics, and 1mm thick copper for circuit are used. We offer ceramic/copper joints by diffusion bonding.
Features of our products
• S-DBC Circuits with SiN, AlN, BeO and Al2O3
. • No Voids
• Strong Adhesivity from Sputtering Diffusion Bonding Method
. • High Thermal Conductivity (No Active Metal Alloys on boundary)
• Passed 3000 T/C test (-40~170C)
S-DBC for EV application (Developed by FJ Composite)
Manufacturing process developed by FJ Composite
No Intermediate active metal layers