H e a t S i n k

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• Thermal Conductivity : XY 280~350W/mK, Z 250~320W/mK

 • CTE: 6.0~8.5ppm/C Adjustable

 • No Voids 

• Strong Adhesivity from Hot Press process (Diffusion Bonding)

 • High Thermal Conductivity (No Active Metal Alloys on boundary)

 • Machinable and Platable 

FJ Composite engineers will design the best layer structure for your application based on your desired CTE and thickness.